3D Integration Program Director Lead Innovation in Telecom & AI
Location: Leuven, Belgium
Are you an expert in 3D integration, semiconductor manufacturing, and cutting-edge materials? Ready to drive innovation in AI, 5G, and next-gen networking? Were looking for a 3D Integration Program Director to lead high-impact R&D projects that shape the future of telecom and beyond!
What Youll Do:
- Lead breakthrough projects in AI/CPU, networking, and 3D engineering.
- Design and implement cutting-edge 3D engineering architectures.
- Turn complex ideas into reality by managing risks and executing technical roadmaps.
- Collaborate globally with top industry experts to push the boundaries of 3D technologies.
- Apply your expertise in 3D IC, advanced packaging, chip stacking, and semiconductor tech.
What You Bring:
- PhD in Engineering, Materials Science, or a related field.
- 10+ years of experience in 3D integration, semiconductor manufacturing, or advanced materials.
- Deep knowledge of 3D IC technologies, heterogeneous integration, MEMS, and chip stacking.
- Strong leadership & communication skills to work with top-tier researchers and engineers.
- A problem-solving mindset with the ability to manage complex, high-stakes projects.
Why Join Us?
- Work at the forefront of innovation in AI, 5G, and advanced networking.
- Collaborate with global experts and lead game-changing research.
- Be part of a company driving next-gen digital transformation.
Are you ready to lead the future of 3D integration? Apply now and lets innovate together!