Requirements: English
Company: IC Resources
Region: Pisa , Tuscany
Our innovative new start-up developing ultra-highbandwidth, low latency optical interconnects for generative AI,cellular, and high bandwidth data transfer applications is nowsearching for an Advanced Packaging Engineer to drive the devicepackaging projects and road-maps for the company. The role willinvolve developing 2.5/3D advanced packaging solutions and liaisingwith OSAT''s for the cycle of concept-explore, design, DFM,engineering runs, development and quality/reliability. Managing theinternal packaging team will be a key part of the role as well asdriving overall package development within the company. This rolecan worked from a remote location. Required skills for the AdvancedPackaging Engineer will include: - Strong semiconductor packagingexperience and knowledge - 2.5/3D advanced packaging solutionsknowledge - Excellent communication and ability to manage teams -Previous experience with liasing with OSAT''s - Degree qualifiedPlease contact Rachel Anderson for further details.