Requirements: English
Company: IC Resources
Region: Pisa , Tuscany
Our innovative start-up, developing ultra-high bandwidth, low latency optical interconnects for generative AI, cellular, and high bandwidth data transfer applications, is seeking an Advanced Packaging Engineer to lead device packaging projects and roadmaps. The role involves developing 2.5/3D advanced packaging solutions and liaising with OSATs throughout the cycle of concept exploration, design, DFM, engineering runs, development, and quality/reliability. Managing the internal packaging team and driving overall package development within the company are key responsibilities. This position can be worked remotely.Required skills:Strong semiconductor packaging experience and knowledgeKnowledge of 2.5/3D advanced packaging solutionsExcellent communication skills and team management abilitiesExperience liaising with OSATsPlease contact Rachel Anderson for further details.Seniority levelMid-Senior levelEmployment typeFull-timeJob functionEngineering, Manufacturing, and ScienceIndustriesSemiconductor Manufacturing and Nanotechnology Research#J-18808-Ljbffr