Our Grenoble based client is currently searching for a Photonics Packaging Engineer to join silicon photonic chip packaging team. The role will involve designing advanced packaging solutions for silicon photonic ICs and taking them from design to mass production. Identifying and managing subcontractors will be an important part of the role, as well as interaction with customers to ensure product requirements are met.
Required skills for the Photonics Packaging Engineer will include:
Please contact Rachel Anderson for further details.