Requirements: English
Company: 2D Photonics
Region: Pisa , Tuscany
At2D PhotonicsandCamGraPhICwe develop ultra-high bandwidth, low-latency optical interconnects for generative AI, cellular, and high-bandwidth data transfer applications.Our Graphene Integrated Photonics (GIP) offers superior capabilities for next-generation transceivers. The way we incorporate graphene with silicon photonics preserves its unique electro-optical properties and enables a next generation of optical interconnect devices with reduced electronic complexity, improved energy consumption, and higher channel density.AtCamGraPhICin Pisa, Italy we run the 700 sqm Inphotec Graphene Photonics development facility, where our team of industry-leading scientists, process development and photonics engineers are pioneering the design and fabrication of Photonic Integrated Circuits (PICs) incorporating Graphene.CamGraPhIC Srlis a wholly owned subsidiary of2D Photonics SpAWho are we looking for?We are seeking a Principal Advanced 3D Packaging Engineer to drive the design and development of innovative 3D packaging solutions for ultra-high bandwidth, low latency optical interconnects targeting generative AI, cellular, and high bandwidth data transfer applications. You will have a proven track record in developing innovative packaging solutions for optical or photonics applications.What will you be doing?Developing and executing strategies to integrate industry-leading advanced packaging technologies into our optical interconnect solutionsEvaluating and selecting Advanced Packaging technologies across 2.5D, 3D and heterogeneous integration domainsCollaborating with internal silicon, photonics, and simulation teams to co-design packaging solutions and seamlessly integrate devices, substrates and interposersDriving innovation in thermal, power, mechanical and signal integrity simulation and package designEstablishing relationships with foundry partners, OSATs and suppliers to evaluate concepts, develop solutions, and qualify designsWhat we need to see?Bachelor or Masters in relevant Engineering discipline with 10+ years industry experienceTrack record in 3D Advanced Package development including proven experience in designing for organic, CoWoS or EMIB substrate technologiesExperience with industry-leading simulation platforms for mechanical, thermal and performance modellingDeep understand of materials science and materials selection for substrate and interconnect designTrack record of taking advanced packaging designs from concept through to qualification and productionStrong analytical and problem-solving skills with a data-driven, detail-oriented approachExcellent English verbal and written communication skillsExperience working, communicating, and collaborating in a cross-functional teamAn ability to adapt to a fast-moving start-up environment, striving for innovation and excellence in everything you doWe look forward to reviewing your application!