Requirements: English
Company: JR Italy
Region: Pisa , Toscana
Social network you want to login/join with:Job Title: Advanced Packaging EngineerOur innovative start-up, developing ultra-high bandwidth, low latency optical interconnects for generative AI, cellular, and high bandwidth data transfer applications, is seeking an Advanced Packaging Engineer. The role involves driving device packaging projects and roadmaps, developing 2.5/3D advanced packaging solutions, and liaising with OSATs throughout the project lifecycle, including concept exploration, design, DFM, engineering runs, development, and quality/reliability.Managing the internal packaging team and driving overall package development within the company are key responsibilities. This position can be performed remotely.Required Skills:Strong semiconductor packaging experience and knowledgeKnowledge of 2.5/3D advanced packaging solutionsExcellent communication skills and team management abilitiesExperience liaising with OSATsPlease contact Rachel Anderson for further details.#J-18808-Ljbffr